This week, these ten stocks, all currently earning A’s (“strong buy”) on Portfolio Grader, have the best year-to-date performance.
Since January 1, Texas Pacific Land () has jumped 36.8%. Texas Pacific Land Trust derives revenue from all avenues of managing land, such as royalties from oil and gas and land sales. .
Top 10 Regional Bank Companies To Invest In 2015: Taiwan Semiconductor Manufacturing Co Ltd (TSM)
Taiwan Semiconductor Manufacturing Co., Ltd. is a Taiwan-based company principally engaged in the research, development, manufacture and distribution of integrated circuit (IC) related products. The Company operates its businesses through wafer manufacture, mask production, wafer testing and packaging components. The Company also involves in the provision of production management, customer services and design services. Its products and services are applied in the manufacture of personal computers and peripheral products, information related products, wire and wireless communication systems, automobile and industrial equipment, as well as consumer electronic products, such as digital disk players, digital televisions (TVs), game consoles, digital cameras, among others. Its customers include Altera, AMD, Broadcom, Marvell, NVIDIA, Qualcomm, Analog Devices, Freescale, NXP and Texas Instruments, among others. In July 2010, Taiwan Semiconductor Manufacturing Co. acquired mechanical and engineering equipment from ASML HONG KONG LTD. In September 2010, the Company acquired a set of equipments from ASML HONG KONG LTD. In December 2010, the Company acquired a set of equipment from TOKYO ELECTRON LTD., KLA-TENCOR CORP. and NOVELLUS SYSTEMS INTERNATIONAL,B.V. In January 2011, the Company announced that it had acquired a set of equipment from KLA-TENCOR CORP., a set of equipment and facility, and another set of equipment from VARIAN SEMI. EQUIP. ASSOCIATES GmbH. In March 2011, the Company acquired a set of equipments from Rudolph Technologies, Inc.In March 2011, the Company acquired a set of equipments from Rudolph Technologies, Inc. In May 2011, it acquired a set of equipments form APPLIED MATERIALS SOUTH EAST ASIA PACIFIC LTD., Hamatech APE Gmbh and CO. KG, TOKYO ELECTRON LTD., DAINIPPON SCREEN MFG. CO., LTD., and VARIAN SEMI. EQUIP. ASSOCIATES GMBH.
TSMC's customers include semiconductor companies, ranging from fabless semiconductor and systems companies, such as Advanced Micro Devices, In! c., Altera Corporation, Broadcom Corporation, Marvell Semiconductor Inc., MediaTek Inc., nVidia Corporation and Qualcomm Incorporated, to integrated device manufacturers, such as LSI Corporation, STMicroelectronics and Texas Instruments Inc. Fabless semiconductor and system companies accounted for approximately 80%, and integrated device manufacturers accounted for approximately 20% of its net sales as of December 31, 2009.
The Company manufactures semiconductors using CMOS and BiCMOS processes. The BiCMOS process combines the speed of the bipolar circuitry and the power consumption and density of the CMOS circuitry. It uses the CMOS process to manufacture logic semiconductors, memory semiconductors, including static random access memory (SRAM), flash memory, mixed-signal/ radio frequency (RF) semiconductors, which combine analog and digital circuitry in a single semiconductor, micro-electro-mechanical-system (MEMS), which combines micrometer featured mechanical parts, analog and digital circuitry in a single semiconductor, and embedded memory semiconductors, which combine logic and memory in a single semiconductor. The BiCMOS process is used to make high-end mixed-signal and other types of semiconductors.
Advisors' Opinion:- [By Charles Sizemore]
For example, the iShares MSCI Emerging Markets ETF (EEM) is comprised of companies that, while domiciled in the emerging world, get a large chunk of their revenues from exporting to the West. Think Samsung (SSNLF) and Taiwan Semiconductor (TSM). (Whether South Korea and Taiwan are ��merging markets��or ��eveloped markets��is another debate for another day, but both countries are well represented in EEM.)
- [By Evan Niu, CFA]
Investors have been talking about Apple (NASDAQ: AAPL ) hooking up with Taiwan Semiconductor (NYSE: TSM ) for years. However, switching chip foundries is much easier said than done and the transition can take quite a while. Well, DIGITIMES now reports that the long-rumored deal has finally been inked as Apple continues to distances itself from Samsung.
- [By Steve Heller]
But you know what's really profitable? Being a foundry to other chip makers -- exactly how Taiwan Semiconductor (NYSE: TSM ) makes a living.
- [By Anders Bylund]
Rumor has it that the two frenemies will put some distance between them. Taiwanese tech publication DigiTimes has long suggested that Apple's core chips might find a new home in massive chip foundry Taiwan Semiconductor Manufacturing (NYSE: TSM ) -- and now the publications claims that it's a done deal.
Top Semiconductor Companies To Invest In 2014: Dialog Semiconductor PLC (DLG)
Dialog Semiconductor Plc creates integrated, mixed signal integrated circuits (ICs), optimized for personal portable, short-range wireless, lighting, display and automotive applications. The Company operates in three business segments: Mobile Systems, Automotive and Industrial, and Connectivity. The Mobile Systems segment includes its power management and audio chips especially designed to meet the needs of the wireless systems markets and a range of advanced driver technologies for low power display applications - from Passive Matrix Organic Light Emitting Diodes (PMOLEDs), to electronic paper and Micro Electro-Mechanical Systems (MEMS) displays. The Automotive and Industrial segment consists of products, which address the safety, management and control of electronic systems in cars and for industrial applications. The Connectivity segment includes activities, such as short-range wireless, digital cordless and voice over Internet protocol (VoIP) technology. Advisors' Opinion:- [By Corinne Gretler]
Colruyt SA jumped the most in almost a year after reporting earnings that beat estimates. Direct Line Insurance Group Plc (DLG), the U.K.�� biggest home and motor insurer, rallied 3.8 percent after saying it will cut jobs. GSW Immobilien AG, Berlin�� largest residential landlord by market value, advanced 3.8 percent after saying both its chairman and chief executive officer will leave. Mining companies declined as metals fell.
Top Semiconductor Companies To Invest In 2014: Aixtron SE (AIXG)
AIXTRON SE (AIXTRON), formerly AIXTRON AG, incorporated in 1983, is a provider of deposition equipment equipment to the semiconductor and compound-semiconductor industry. The Company's technology solutions are used by a diverse range of customers worldwide to build advanced components for electronic and opto-electronic applications based on compound, silicon, or organic semiconductor materials. Such components are used in fiber optic communication systems, wireless and mobile telephony applications, optical and electronic storage devices, computing, signaling and lighting, displays, as well as a range of other technologies. AIXTRON's business activities include developing, producing and installing equipment for coating semiconductor materials, process engineering, consulting and training, including ongoing customer support. AIXTRON supplies to customers both full production-scale complex material deposition systems and small scale systems for research and development (R&D) use and small-scale production use.
AIXTRON's product range includes customized production and research scale compound semiconductor systems capable of depositing material films on up to 95 * two-inch diameter wafers per single production run, or smaller multiples of larger diameter wafers, employing MOCVD or Hydride Vapor Phase Epitaxy (HVPE) or organic thin film deposition on up to Gen. 3.5 substrates, including Polymer Vapor Phase Deposition (PVPD) or Organic Vapor Phase Deposition (OVPD) or large area deposition for Organic Light Emitting Diodes (OLED) applications or Plasma Enhanced Chemical Vapor Phase Deposition (PECVD) for depositing complex Carbon Nanostructures (Carbon Nanotubes, Nanowires or Graphene). AIXTRON also manufactures full production and research scale deposition systems for silicon semiconductor applications capable of depositing material films on wafers of up to 300 millimeters diameter, employing technologies, such as Chemical Vapor Deposition (CVD), Atomic Vapor Deposition (AVD) and Atomic Layer! Deposition (ALD).
AIXTRON also offers a range of peripheral equipment and services, including products capable of monitoring the concentration of gases in the air and for cleaning the exhaust gas from metal organic chemical vapor deposition processes. The Company also assists its customers in designing the production layouts for the gas supply to thin film deposition systems. Additionally, the Company offers its customers training, consulting and support services.
The Company competes with Veeco Instruments Inc. (USA), Taiyo Nippon Sanso (Japan), Ulvac, Inc. (Japan), Tokki Corporation (Japan), Sumitomo (Japan), Applied Materials, Inc. (USA), Doosan DND Co., Ltd. (South Korea), Sunic System (South Korea), Tokyo Electron Ltd. (Japan), ASM International N.V. (Netherlands), IPS Technology (South Korea), Jusung Engineering Co. Ltd. (South Korea), and Hitachi Kokusai Electric Co. Inc. (Japan).
Advisors' Opinion:- [By Rich Smith]
This series, brought to you by Yahoo! Finance, looks at which upgrades and downgrades make sense and which ones investors should act on. Today, our headlines include upgrades for both industrialist Aixtron (NASDAQ: AIXG ) and fashionista bebe stores (NASDAQ: BEBE ) . But the news isn't all good, so let's start off with a few words on...
- [By Jon C. Ogg]
Aixtron SE (NASDAQ: AIXG) was downgraded to Sell from Hold at Canaccord Genuity.
Buffalo Wild Wings Inc. (NASDAQ: BWLD) was downgraded to Outperform from Strong Buy at Raymond James.
Top Semiconductor Companies To Invest In 2014: Advanced Semiconductor Engineering Inc (ASX)
Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.
The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.
Packaging Services
The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).
The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.
The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.
Testing Services
The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.
The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.
Advisors' Opinion:- [By Namitha Jagadeesh]
The FTSE 100 Index (UKX) fell 1.31 points, less than 0.1 percent, to 6,679.77 at 10:12 a.m. in London, trimming an earlier decline of as much as 0.6 percent. The gauge has climbed 13 percent this year as central banks maintained stimulus measures to support the global economy. The broader FTSE All-Share Index (ASX) was also little changed today, while Ireland�� ISEQ Index retreated 0.3 percent.
Top Semiconductor Companies To Invest In 2014: Advantest Corp (ATE)
Advantest Corporation, incorporated in December 1954, is a part of Advantest group. The Company operates in three segments: semiconductor and component test system segment; mechatronics system segment, focusing on peripheral devices including test handlers and device interfaces, and services, support and others segment. The semiconductor and component test system segment provides customers with test system products for the semiconductor industry and the electronic component industry. The mechatronics system segment focuses on peripheral devices to the semiconductor and component test systems. The services, support and others segment consists of comprehensive customer solutions provided in connection with the semiconductor and component test system and mechatronics system segments, support services and an equipment lease business.
Semiconductor and Component Test Systems Segment
Semiconductor and component test systems are used during the semiconductor and electronic component manufacturing process to confirm that a semiconductor functions properly. Semiconductor and component test systems consist of test systems for memory semiconductors and test systems for non memory semiconductors. Advantest�� test systems for memory semiconductors are test systems designed to test high-speed/high performance dynamic random access memory (DRAM) semiconductors used in equipment such as personal computers and servers, as well as flash memory semiconductors used in digital consumer products.
Test systems for memory semiconductors consist of a mainframe and one or more test heads. During testing, a device interface is attached to the test head. During the front-end testing process, wafers are loaded by a prober and are connected to the test system for memory semiconductors through the device interface. Electric signals between the die and the test systems for memory semiconductors are transmitted through probe pins located in the device interface and tested. After front-end te! sting is completed, the wafer is diced into separate dies and properly functioning dies are packaged. During back-end testing, test handlers are used to load these packaged devices onto the test heads, and electric signals are transmitted between the devices and the test heads via the device interface and tested. The test results are analyzed by the test systems for memory semiconductors��hardware circuits and software programs. Customized software programs for each semiconductor are required to analyze the semiconductor tests and test data.
Advantest�� main product lines of test systems for memory semiconductors are the T5500 series, the T5300 series and the T5700 series. The T5593 is a test system targeted at the market for high speed memory semiconductors, such as DDR2- Synchronous Dynamic Random Access Memory (SDRAM) and Synchronous Graphics Random Access Memory (SGRAM). The T5383 is a multi-functional test system for memory semiconductors that reduces testing costs for semiconductor manufacturers. Advantest�� main line of test systems for non memory semiconductors relates to test systems for SoC semiconductors, test systems for liquid crystal display (LCD) driver integrated circuits and test systems for semiconductors used in car electronics. The T6577 test systems for SoC semiconductors in the T6500 series were primarily developed to test micro controller unit (MCU) and SoC semiconductors that control digital consumer products at the production lines. The T6300 series are test systems for LCD driver integrated circuits used with high-definition LCD displays. The T7721, T7722 and T7723 are test systems for non memory semiconductors for mixed signal integrated circuits. The T8571A is a test system for non memory semiconductors that is primarily used to evaluate and analyze CCDs which are image sensors.
Mechatronics System Segment
The Main products in the Mechatronics System Segment are test handlers which handle semiconductor devices and automate the te! sting, an! d device interfaces which are the interfaces with devices being tested. Test handlers are used with semiconductor and component test systems to handle, condition temperature, contact and sort semiconductors and other electronic components during the back-end testing of the semiconductor manufacturing process. Advantest�� test handlers are sold primarily in conjunction with the sale of its semiconductor and component test systems. The M6242 test handler for test systems for memory semiconductors, including DDR-3SDRAM, can handle up to 512 semiconductors at a time. Advantest�� test handlers for non memory semiconductors, including SoC semiconductors, are the M4841, the M4741A and the M4742A, among others.
Advantest develops and manufactures device interfaces for semiconductor and component test systems and supplies device interfaces, such as high performance and high density connectors, socket boards and sockets. For test systems for memory semiconductors, Advantest provides motherboards capable of handling a maximum of 512 semiconductors at a time. For test systems for non memory semiconductors, Advantest provides motherboards that are compatible with a maximum of 3,072 signals. Advantest also provides motherboards designed for use in front-end testing. Advantest provides custom manufacturing of socket boards and performance boards for each device under test in accordance with customers��specifications.
Advantest provides sockets for test systems for memory semiconductors. Advantest provides low-inductance (0.4nH) sockets and fine pitch (0.4mm) sockets for semiconductors that are becoming more high-speed and more compact in size. Advantest provides carrying and contacting mechanism components compatible with each device under test for test handlers for memory semiconductors and test handlers for non memory semiconductors.
Services, Support and Others Segment
In the services, support and others segment, Advantest has focused on maintenance serv! ices, suc! h as installation and repair of Advantest�� products. It also focused on lease and rental services of its products as a part of Advantest�� effort to provide customers with comprehensive solutions.
The Company competes with Teradyne, Inc., Verigy Ltd., LTX-Credence Corporation, Yokogawa Electronic Corporation, FROM30 CO., LTD., EXICON Ltd., UniTest Inc., Delta Design, Inc., Seiko Epson Corporation, Mirae Corporation, TechWing, Inc., TSE Co., Ltd. and Secron Co., Ltd.
Advisors' Opinion:- [By Dan Carroll]
Nissan's done better this year than electronics maker Advantest (NYSE: ATE ) , but this stock absolutely blew up over the past week. Advantest's shares shot higher by more than 9%, wiping out pessimism over the company's weak earnings released a few weeks ago. Advantest's net loss and operating profit both fell below its guidance, and despite this week's investor optimism, the future's murky for this company. Financial site TheStreet downgraded the stock last week, citing Advantest's falling earnings, among other issues.
Top Semiconductor Companies To Invest In 2014: Tokyo Electron Ltd (TOELY.PK)
Tokyo Electron Limited is a company mainly engaged in the manufacture and sale of electronic products for industrial uses. The Semiconductor Manufacturing Equipment, Flat-panel Display (FPD) and Photovoltaic Cell (PV) Manufacturing Equipment segment provides coaters and developers for wafer processing, plasma etching equipment, thermal processing systems, single wafer deposition systems, cleaning systems, coaters and developers for FPD manufacturing, ashing devices and plasma chemical vapor deposition (CVD) devices. The Electronic Component and Information Communication Equipment segment designs, develops, purchases and sells semiconductor products such as integrated circuits (ICs), computer and network equipment and software. The Others segment involves in logistics, facility management and insurance businesses. On April 1, 2013, it merged with two subsidiaries. In January 2014, the Company established TEL-Applied Holdings B.V. and a Japan-based company. Advisors' Opinion:- [By Stephen Simpson, CFA]
Ultratech isn't the only game in town, though, and there are multiple technologies and process steps that are going to play significant roles in the production of FinFETs and 3D circuits. With that, I would take a look at Mattson Technologies (MTSN), as this company has already accomplished the not-so-easy task of gaining meaningful share in the dry strip, rapid thermal processing (RTP), and etch markets despite competing with giants like Lam Research (LRCX), Applied Materials (AMAT), and Tokyo Electron (TOELY.PK).
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